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66AK2H12DAAW24 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC HAWKING 1.2GHZ DSP 1.4GHZ ARM 0 TO 85

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66AK2H12DAAW24 - Texas Instruments PCB footprint - BGA - BGA - AAW1517B
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66AK2H12DAAW24 - Texas Instruments  - 3D model - BGA - AAW1517B
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66AK2H12DAAW24 Details

  • Manufacturer Part Number:

    66AK2H12DAAW24

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.31.00.75

  • Date Of Intro:

    2017-07-27

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.62 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H12DAAW24 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in their documentation, which includes guidelines for signal routing, power supply decoupling, and thermal management. It's essential to follow these guidelines to ensure optimal performance, low noise, and minimal electromagnetic interference (EMI).
  • The 66AK2H12DAAW24 has multiple operating modes, such as turbo mode, low-power mode, and sleep mode. Configuration is done through register programming, and Texas Instruments provides a detailed register map and programming guide in their documentation. Engineers should consult the user's guide and programming manual for specific configuration details.
  • The 66AK2H12DAAW24 is a high-performance device that generates heat. Thermal management is crucial to ensure reliable operation and prevent overheating. Engineers should consider using heat sinks, thermal interfaces, and thermal vias on the PCB to dissipate heat effectively. Texas Instruments provides thermal design guidelines and junction-to-case thermal resistance (RθJC) values in their documentation.
  • Signal integrity is critical in high-speed designs like the 66AK2H12DAAW24. Engineers should follow best practices for signal routing, such as using differential pairs, minimizing trace length, and using signal shielding. Additionally, they should consider using signal conditioning components, such as capacitors and resistors, to filter out noise and ensure signal quality.
  • The 66AK2H12DAAW24 requires a stable power supply to operate correctly. Engineers should ensure that the power supply voltage is within the recommended range, and that the power supply noise is minimized. Decoupling capacitors should be placed close to the device to filter out noise and ensure stable operation.

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66AK2H12DAAW24 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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