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6ED2230S12TXUMA1 - Infineon

Description: 1200V THREE PHASE DRIVER

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6ED2230S12TXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - DSO-24 (DSO-28 4 )
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6ED2230S12TXUMA1 - Infineon  - 3D model - Small Outline Packages - DSO-24 (DSO-28 4 )
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6ED2230S12TXUMA1 Details

  • Manufacturer Part Number:

    6ED2230S12TXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Indonesia, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-08-22

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    FULL BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    18.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    0.65 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24/28,.40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    13 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    1220 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.85 µs

  • Turn-on Time:

    0.9 µs

  • Width:

    7.5 mm

6ED2230S12TXUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • Infineon recommends a soldering profile with a peak temperature of 260°C for a maximum of 10 seconds. The device should be soldered using a reflow soldering process with a nitrogen atmosphere to prevent oxidation.
  • Handle the device with ESD-protective materials and tools. Store the device in its original packaging or in a conductive bag with a dissipative material. Ground yourself before handling the device, and avoid touching the pins or leads.
  • The 6ED2230S12TXUMA1 has an MSL rating of 3, which means it can withstand a maximum exposure of 168 hours at 30°C and 60% relative humidity before soldering.

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6ED2230S12TXUMA1 Overview

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