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6PAIC3104IRHBRQ1 - Texas Instruments

Description: Automotive Low-Power Stereo Audio Codec with 6 Audio Input Pins and 6 Audio Output Drivers

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PCB Footprints
6PAIC3104IRHBRQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHB0032E-1
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3D Models
6PAIC3104IRHBRQ1 - Texas Instruments  - 3D model - Quad Flat No-Lead - RHB0032E-1
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6PAIC3104IRHBRQ1 Details

  • Manufacturer Part Number:

    6PAIC3104IRHBRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-32

  • Pin Count:

    32

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Filter:

    YES

  • Input Code:

    TWOS COMPLEMENT

  • Input Type:

    SINGLE-ENDED,DIFF

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Linear Coding:

    16-BIT

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    VOLTAGE

  • Output Code:

    TWOS COMPLEMENT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    PROGRAMMABLE CODEC

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

6PAIC3104IRHBRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The thermal pad should be connected to the ground plane to dissipate heat efficiently.
  • Use controlled impedance traces, and follow the recommended routing guidelines for the high-speed interfaces such as PCIe and SATA. Also, use signal integrity analysis tools to simulate and optimize the signal transmission.
  • The device requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is: 1) VCC, 2) VCCP, 3) VCCIO, and 4) VREF. The power-down sequence should be reversed.
  • The thermal shutdown feature is enabled by default. When the device temperature exceeds 125°C, it will shut down. To handle this, implement a thermal monitoring system to detect the shutdown and take corrective action, such as reducing the clock frequency or shutting down the system.
  • Use 0.1uF to 1uF decoupling capacitors with a voltage rating of 2.5V or higher. Place them as close as possible to the power pins, with a maximum distance of 1mm. Use a capacitor with a low ESR (Equivalent Series Resistance) to minimize power noise.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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