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7024L20PFGI - Renesas Electronics

Description: The 7024 is a high-speed 4Kx 16 Dual-Port Static RAM designed to be used as a stand-alone 64K-bit Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit or more word systems. An automatic power down feature controlled by Chip Enable (CE) permits the on-chip circuitry of each port to enter a very low standby power mode. Military grade product in compliance with MIL-PRF-38535 QML is available.

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7024L20PFGI - Renesas Electronics - PCB symbol
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7024L20PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin TQFP-ren1
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7024L20PFGI - Renesas Electronics - 3D model - Quad Flat Packages - 100-Pin TQFP-ren1
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7024L20PFGI Details

  • Manufacturer Part Number:

    7024L20PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PNG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    20 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    100

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.004 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.32 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

7024L20PFGI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • To ensure reliable operation, follow the recommended operating conditions, and consider using a thermal management strategy such as heat sinks or thermal interfaces. Also, ensure that the device is properly decoupled and bypassed to minimize noise and voltage drops.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delays. Ensure timing closure by using a timing analyzer tool, and consider using a clock domain crossing (CDC) strategy to manage clock frequencies and domains.
  • Implement power sequencing by following the recommended power-up and power-down sequences. Use a voltage regulator with a low dropout voltage and a high power supply rejection ratio (PSRR) to ensure stable voltage supply. Consider using a power management IC (PMIC) for efficient power management.
  • To ensure EMI and EMC compliance, follow the recommended PCB layout and routing guidelines, use shielding and filtering techniques, and consider using a common-mode choke or ferrite bead to reduce EMI emissions. Ensure that the device is properly decoupled and bypassed to minimize noise and voltage drops.

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