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70261L20PFGI - Renesas Electronics

Description: The 70261 is a high-speed 16K x 16 Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit-or-more word systems. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode.

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70261L20PFGI Details

  • Manufacturer Part Number:

    70261L20PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PNG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    20 ns

  • Additional Feature:

    INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Memory Density:

    262144 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16KX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    QUAD

70261L20PFGI Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, ensuring a solid ground plane, and using thermal vias to dissipate heat. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout, use shielding, and implement filtering and decoupling techniques. Also, consider using a common-mode choke and ferrite beads to reduce emissions.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) first, followed by the input voltage (VIN). For power-down, reverse the sequence. Ensure that the input voltage is removed before the power supply voltage to prevent damage.
  • Implement an overvoltage protection circuit to prevent damage from voltage spikes. For UVLO, use a voltage monitor or supervisor IC to detect undervoltage conditions and reset the device or trigger a power-down sequence.
  • Ensure good airflow, use a heat sink or thermal interface material, and follow the recommended PCB layout to minimize thermal resistance. Monitor the device temperature and implement thermal shutdown or warning mechanisms to prevent overheating.

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70261L20PFGI Overview

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Part Image 70261S20PFGI Renesas Electronics Corporation

Multi-Port SRAM, 16KX16, 20ns, CMOS, PQFP100

Part Image 70261L20PF Integrated Device Technology Inc

Multi-Port SRAM, 16KX16, 20ns, CMOS, PQFP100

Part Image 70261L20PFI Integrated Device Technology Inc

Multi-Port SRAM, 16KX16, 20ns, CMOS, PQFP100

Part Image 70261S20PFG Renesas Electronics Corporation

Multi-Port SRAM, 16KX16, 20ns, CMOS, PQFP100

Part Image 70261S20PFG8 Renesas Electronics Corporation

Multi-Port SRAM, 16KX16, 20ns, CMOS, PQFP100

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