Description:The 7027 is a high-speed 32K x 16 Dual-Port Static RAM designed to be used as a stand-alone 512K-bit Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit-or-more word systems. An automatic power down feature permits the on-chip circuitry of each port to enter a very low standby power mode. Military grade product in compliance with MIL-PRF-38535 QML is available.
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE
I/O Type:
COMMON
JESD-30 Code:
S-PQFP-G100
JESD-609 Code:
e3
Length:
14 mm
Memory Density:
524288 bit
Memory IC Type:
MULTI-PORT SRAM
Memory Width:
16
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Ports:
2
Number of Terminals:
100
Number of Words:
32768 words
Number of Words Code:
32000
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Organization:
32KX16
Output Characteristics:
3-STATE
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFQFP
Package Equivalence Code:
QFP100,.63SQ,20
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.6 mm
Standby Current-Max:
0.01 A
Standby Voltage-Min:
4.5 V
Supply Current-Max:
0.335 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
4.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
14 mm
7027L20PFGI Frequently Asked Questions (FAQs)
For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently.
To ensure reliable operation across the entire operating temperature range, it is recommended to follow the recommended operating conditions, use a suitable thermal design, and implement adequate power sequencing and supply voltage monitoring.
To mitigate EMI and RFI, use a multi-layer PCB, keep sensitive analog signals away from digital signals, use shielding and filtering, and follow good PCB layout practices such as minimizing loop areas and using decoupling capacitors.
To optimize power consumption, use the device's power-saving modes, optimize clock frequencies, use dynamic voltage and frequency scaling, and minimize idle time by using low-power sleep modes.
Recommended testing and validation procedures include functional testing, boundary scan testing, and environmental testing such as temperature and vibration testing to ensure the device meets the required specifications.
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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored
7027L20PFGI Overview
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