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70T3319S166BC - Renesas Electronics

Description: The 70T3319 is a high-speed 256K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3319 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3319S166BC - Renesas Electronics - PCB symbol
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70T3319S166BC - Renesas Electronics PCB footprint - BGA - BGA - BC256-_
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70T3319S166BC - Renesas Electronics - 3D model - BGA - BC256-_
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70T3319S166BC Details

  • Manufacturer Part Number:

    70T3319S166BC

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T3319S166BC Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal vias, copper pours, and component placement guidelines to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and threshold voltage.
  • Renesas recommends using a low-ESR ceramic capacitor with a value between 4.7uF to 10uF, depending on the input voltage and output current requirements. The datasheet provides more detailed guidance on input capacitor selection.
  • Renesas provides EMC guidelines in their application notes, including recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant standards.
  • The 70T3319S166BC has an operating temperature range of -40°C to +125°C, but Renesas recommends derating the output current and voltage at higher temperatures to ensure reliable operation.

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70T3319S166BC Alternates

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Part Image IDT70T3319S166BC Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 12ns, CMOS, PBGA256
Part Image 70T3319S166BCG Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256
Part Image IDT70V3319S166BCG8 Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 12ns, CMOS, PBGA256
Part Image IDT70T3319S166BCGI Renesas Electronics Corporation

Multi-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256
Part Image IDT70V3319S166BCG Renesas Electronics Corporation

Multi-Port SRAM, 256KX18, 3.6ns, CMOS, CBGA256
For a full list of alternate parts for 70T3319S166BC, check out Findchips.com