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70T3799MS133BBG - Renesas Electronics

Description: The 70T3799M is a high-speed 128K x 72 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3799M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3799MS133BBG - Renesas Electronics - PCB symbol
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70T3799MS133BBG - Renesas Electronics PCB footprint - BGA - BGA - BBG324_3
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70T3799MS133BBG - Renesas Electronics - 3D model - BGA - BBG324_3
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70T3799MS133BBG Details

  • Manufacturer Part Number:

    70T3799MS133BBG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PBGA

  • Pin Count:

    324

  • Manufacturer Package Code:

    BBG324

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    15 ns

  • Additional Feature:

    PIPELINED OR FLOW-THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    72

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    324

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX72

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.74 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

70T3799MS133BBG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas recommends using a high-quality voltage regulator with low noise and high PSRR. Decoupling capacitors should be placed close to the device, and noise reduction techniques like filtering and shielding should be employed to minimize electromagnetic interference.
  • The 70T3799MS133BBG requires a high-quality clock signal with low jitter and noise. Renesas recommends using a clock signal with a frequency tolerance of ±100 ppm and a signal amplitude of 1.8V ± 0.1V. Clock signal integrity can be ensured by using a clock buffer, proper PCB layout, and signal termination.
  • Renesas provides a boot loader and firmware loading guidelines in their documentation. The boot process can be optimized by using a fast boot mode, minimizing firmware size, and optimizing the boot loader configuration.
  • Renesas recommends using their e² studio integrated development environment (IDE) and the corresponding debugger tools for debugging and troubleshooting. Other best practices include using print statements, logic analyzers, and oscilloscopes to identify and isolate issues.

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