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70T653MS12BCI - Renesas Electronics

Description: The 70T653M is a high-speed 256K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone 18874K-bit Dual-Port RAM. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

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70T653MS12BCI - Renesas Electronics PCB footprint - BGA - BGA - BC256
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70T653MS12BCI Details

  • Manufacturer Part Number:

    70T653MS12BCI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.79 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T653MS12BCI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, the device should be properly decoupled, and the PCB should be designed to minimize thermal gradients.
  • The critical timing parameters for the 70T653MS12BCI include clock frequency, clock-to-output delay, and output hold time. To ensure these parameters are met, it is essential to follow the recommended clocking scheme, use a high-quality clock source, and ensure that the output loads are properly terminated.
  • Power sequencing and reset signals should be handled according to the recommended power-up and power-down sequences outlined in the datasheet. The reset signal should be asserted for a minimum duration to ensure proper device initialization.
  • The 70T653MS12BCI is a sensitive device and requires proper ESD protection and handling procedures to prevent damage. It is recommended to follow standard ESD handling procedures, including the use of ESD-safe workstations, wrist straps, and packaging materials.

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70T653MS12BCI Overview

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Part Image IDT70T653MS12BCGI Integrated Device Technology Inc

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