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70T659S10BCI - Renesas Electronics

Description: The 70T659 is a high-speed 128K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 72-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

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70T659S10BCI - Renesas Electronics PCB footprint - BGA - BGA - BC256--_
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70T659S10BCI Details

  • Manufacturer Part Number:

    70T659S10BCI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    10 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.445 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70T659S10BCI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-0701) for thermal management. It suggests using a 4-layer PCB with a thermal relief pattern on the bottom layer, and placing thermal vias under the package to improve heat dissipation.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. The VCCIO pin should be powered up first, followed by the VCC core voltage, and then the VREF pin. A detailed power sequencing diagram is available in the datasheet.
  • Although not explicitly stated in the datasheet, Renesas recommends keeping the capacitance on the VREF pin below 100 nF to ensure stable operation and prevent oscillations.
  • Renesas provides a JTAG boundary scan description language (BSDL) file for the 70T659S10BCI, which can be used with industry-standard JTAG test equipment. Additionally, Renesas recommends using a JTAG signal buffer to ensure signal integrity during testing.
  • Although the datasheet specifies an operating temperature range of -40°C to 85°C, Renesas recommends derating the device's performance at temperatures above 70°C to ensure long-term reliability.

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70T659S10BCI Alternates

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Part Image 70T659S10BCG Renesas Electronics Corporation

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