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70V05L15JG8 - Renesas Electronics

Description: The 70V05 is a high-speed 8K x 8 Dual-Port Static RAM designed to be used as a stand-alone 64K-bit Dual-Port SRAM or as a combination MASTER/SLAVE Dual-Port SRAM for 16-bit-or-more word systems which results in full speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode.

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70V05L15JG8 - Renesas Electronics - PCB symbol
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70V05L15JG8 - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLG68-ren2
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70V05L15JG8 - Renesas Electronics - 3D model - Plastic Leaded Chip Carrier - PLG68-ren2
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70V05L15JG8 Details

  • Manufacturer Part Number:

    70V05L15JG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Pin Count:

    68

  • Manufacturer Package Code:

    PLG68

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQCC-J68

  • JESD-609 Code:

    e3

  • Length:

    24.2062 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    68

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC68,1.0SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Standby Current-Max:

    0.0025 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.185 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    24.2062 mm

70V05L15JG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in their application note (AP6111) for the 70V05L15JG8. It suggests using a 2-layer or 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' guidelines for thermal design and layout. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Operating the 70V05L15JG8 outside the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's crucial to adhere to the specified operating conditions to ensure optimal performance and longevity.
  • Renesas provides a troubleshooting guide in their application note (AP6111) that covers common issues related to power sequencing and voltage regulation. It's essential to follow the recommended power-up and power-down sequences to avoid damage to the device.
  • The 70V05L15JG8 has built-in ESD protection and latch-up prevention measures. However, it's still essential to follow proper handling and assembly procedures to prevent damage during manufacturing and operation.

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70V05L15JG8 Overview

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