Part Image

70V3319S133BCGI - Renesas Electronics

Description: The 70V3319 is a high-speed 256K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3319 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

Download 70V3319S133BCGI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
70V3319S133BCGI - Renesas Electronics PCB footprint - BGA - BGA - BC256-_-
click to zoom
3D Models
70V3319S133BCGI - Renesas Electronics  - 3D model - BGA - BC256-_-
click to zoom

70V3319S133BCGI Details

  • Manufacturer Part Number:

    70V3319S133BCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BCG256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-CBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.48 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

70V3319S133BCGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout and thermal management guide in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • Renesas recommends using a power sequencing scheme to ensure proper voltage regulation and to prevent damage to the device. A dedicated power management IC or a power sequencer can be used to implement the recommended power-up and power-down sequences.
  • The input and output capacitors play a critical role in the performance and stability of the 70V3319S133BCGI. Renesas recommends using high-quality, low-ESR capacitors with a specific capacitance value and voltage rating. The selection of capacitors should be based on the specific application requirements, such as ripple current, voltage rating, and physical size.
  • Renesas provides troubleshooting guides and application notes that cover common issues and their solutions. It's essential to follow a systematic approach to identify and resolve issues, including checking the PCB layout, component selection, and power supply quality.
  • Renesas provides thermal derating guidelines and junction temperature calculation methods in their datasheet and application notes. It's essential to follow these guidelines to ensure the device operates within the recommended temperature range and to prevent thermal damage.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

70V3319S133BCGI Overview

Use the download button to access the 70V3319S133BCGI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 70V33, or try a keyword search, such as SRAMs

Parts related to 70V3319S133BCGI

Showing 0 results

70V3319S133BCGI Alternates

Showing results

Image Part Number Model
Part Image 70T3319S133BC8 Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 15ns, CMOS, PBGA256

Part Image IDT70V3319S133BCI Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 15ns, CMOS, PBGA256

Part Image IDT70V3319S133BC8 Integrated Device Technology Inc

Multi-Port SRAM, 256KX18, 15ns, CMOS, PBGA256

Part Image IDT70T3319S133BCI8 Renesas Electronics Corporation

Multi-Port SRAM, 256KX18, 15ns, CMOS, PBGA256

Part Image IDT70V3319S133BC8 Renesas Electronics Corporation

Multi-Port SRAM, 256KX18, 15ns, CMOS, PBGA256

For a full list of alternate parts for 70V3319S133BCGI, check out Findchips.com