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70V3319S166PRFG8 - Renesas Electronics

Description: The 70V3319 is a high-speed 256K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3319 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

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70V3319S166PRFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
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70V3319S166PRFG8 - Renesas Electronics  - 3D model - Quad Flat Packages - pkg128
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70V3319S166PRFG8 Details

  • Manufacturer Part Number:

    70V3319S166PRFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    128

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.03 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

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70V3319S166PRFG8 Overview

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Part Image 70V3319S166PRFG Integrated Device Technology Inc

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Part Image IDT70V3319S166PRFGI Renesas Electronics Corporation

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Part Image 70V3319S166PRF Integrated Device Technology Inc

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Part Image 70V3319S166PRF8 Integrated Device Technology Inc

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