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70V3599S133BCGI - Renesas Electronics

Description: The 70V3599 is a high-speed 128K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3599 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

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70V3599S133BCGI - Renesas Electronics PCB footprint - BGA - BGA - BC256-__
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70V3599S133BCGI Details

  • Manufacturer Part Number:

    70V3599S133BCGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    256

  • Manufacturer Package Code:

    BCG256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Access Time-Max:

    15 ns

  • Additional Feature:

    PIPELINED OR FLOW-THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.48 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

70V3599S133BCGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for PCB layout and thermal management in their application notes. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • Renesas recommends using a power management IC (PMIC) specifically designed for the 70V3599S133BCGI. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Renesas provides guidance on power sequencing and voltage regulation in their application notes and design guides.
  • The recommended operating conditions are specified in the datasheet. To ensure reliable operation, it's essential to operate the device within the recommended temperature range, voltage supply, and clock frequency. Additionally, follow proper PCB design and layout guidelines, and ensure adequate power supply decoupling and filtering.
  • Renesas provides a range of debugging tools and resources, including development boards, software development kits, and technical support. Engineers can use these resources to troubleshoot and debug issues with the device. Additionally, Renesas recommends following a structured debugging approach, starting with basic checks such as power supply, clock signals, and reset signals.
  • The 70V3599S133BCGI is a high-speed device, and as such, it's essential to consider EMI and RFI in the design. Renesas recommends following proper PCB design and layout guidelines, using shielding and grounding techniques, and implementing EMI filters and absorbers to mitigate EMI and RFI.

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70V3599S133BCGI Overview

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