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70V657S12BFI8 - Renesas Electronics

Description: The 70V657 is a high-speed 32K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 72-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 72-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each por

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70V657S12BFI8 - Renesas Electronics PCB footprint - BGA - BGA - BFG208-
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70V657S12BFI8 Details

  • Manufacturer Part Number:

    70V657S12BFI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BF208

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e0

  • Length:

    15 mm

  • Memory Density:

    1179648 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.515 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    15 mm

70V657S12BFI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN9834) and design guides (e.g., DG0034). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 70V657S12BFI8 has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or a thermal plane on the PCB. Use thermal interface material (TIM) if necessary. Follow Renesas' thermal design guidelines and consider using thermal simulation tools to optimize your design.
  • The input clock signal should meet the specifications outlined in the datasheet, including frequency, duty cycle, and jitter. Additionally, ensure the clock signal is clean and free from noise, and consider using a clock buffer or jitter attenuator if necessary.
  • Renesas provides guidelines for implementing POR and BOD in their application notes and design guides. Typically, this involves using external resistors and capacitors to create a POR circuit and connecting the BOD pin to a voltage monitoring circuit.
  • Follow Renesas' EMC and EMI guidelines, and consider using shielding, filtering, and grounding techniques to minimize emissions and susceptibility. Ensure proper PCB layout, component placement, and signal routing to reduce EMI.

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70V657S12BFI8 Overview

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