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70V659S10BFG - Renesas Electronics

Description: The 70V659 is a high-speed 128K x 36 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 72-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 72-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each po

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70V659S10BFG - Renesas Electronics PCB footprint - BGA - BGA - BFG208-
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70V659S10BFG Details

  • Manufacturer Part Number:

    70V659S10BFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BFG208

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    10 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

70V659S10BFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3601EU0100) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 70V659S10BFG has an internal POR and BOD circuit. To implement POR, connect the VCC pin to a power supply and ensure it reaches the minimum operating voltage (VCC(min)) before enabling the clock. For BOD, connect the VCC pin to a power supply and set the BOD threshold voltage (VBOD) using the BOD control register.
  • The maximum clock frequency for the 70V659S10BFG is 10 MHz, but it can be overclocked up to 12 MHz with reduced voltage and temperature ranges. However, overclocking may affect the device's reliability and is not recommended for production designs.
  • To configure the UART interface, set the baud rate, data bits, parity, and stop bits using the UART control registers. Ensure the transmitter and receiver are properly connected, and use a suitable clock frequency to avoid data corruption. Additionally, implement flow control and error handling mechanisms to ensure reliable communication.
  • The 70V659S10BFG has a maximum junction temperature (TJ) of 150°C. To manage thermal performance, use a heat sink, ensure good airflow, and avoid high ambient temperatures. Also, reduce power consumption by minimizing clock frequency, using power-down modes, and optimizing software execution.

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70V659S10BFG Overview

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Part Image IDT70V659S10BFG Renesas Electronics Corporation

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