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7109DG - Boyd Corporation

Description: Heat Sinks Surface Mount Heat Sink, TO-263, D2PAK, Horizontal, 9 Degree C/W, Bulk, 25.4mm

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7109DG - Boyd Corporation  - 3D model
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7109DG Details

  • Manufacturer Part Number:

    7109DG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.90.00.00

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Boyd Corporation

  • YTEOL:

    6.78

  • Body Material:

    COPPER

  • Device Used On:

    IC

  • Fin Orientation:

    FOLDEDBACK

  • Finish:

    TIN

  • Height:

    19.38 mm

  • Length:

    25.4 mm

  • Thermal Resistance:

    11 Ω

  • Thermal Support Device Type:

    HEAT SINK

  • Width:

    11.43 mm

7109DG Frequently Asked Questions (FAQs)

  • The recommended application thickness for 7109DG is 0.005-0.015 inches (0.13-0.38 mm). Applying it too thickly can compromise its thermal performance.
  • Yes, 7109DG is designed to withstand high-vibration environments. Its unique filler system and polymer matrix provide excellent durability and resistance to vibration-induced pump-out.
  • While 7109DG can operate at low temperatures, it's not recommended for cryogenic applications (below -40°C). For cryogenic uses, Boyd Corporation offers other thermal interface materials specifically designed for those conditions.
  • To ensure a strong bond, make sure the substrate is clean and dry. Apply a thin, uniform layer of 7109DG, and then apply pressure (e.g., using a clamp or press) to ensure good contact. Curing the material at the recommended temperature (e.g., 100°C for 1 hour) also helps to establish a strong bond.
  • No, 7109DG is electrically insulating. It's designed for thermal management, not electrical conductivity. If you need a thermally conductive material with electrical conductivity, consider other Boyd Corporation products.

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Part Image 7109DG BOYD Laconia

Heat Sink, 11ohm, Foldedback, Copper, Tin