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7164L25TDB - Renesas Electronics

Description: The 7164 5V CMOS SRAM is organized as 8K x 8. The 7164 offers a reduced power standby mode. The low-power (L) version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs of the IDT7164 are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. Military grade product is available.

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7164L25TDB - Renesas Electronics - PCB symbol
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7164L25TDB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - SD28
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7164L25TDB Details

  • Manufacturer Part Number:

    7164L25TDB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SD28

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Memory Density:

    65536 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Standby Current-Max:

    0.0002 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.16 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

7164L25TDB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • The 7164L25TDB has a built-in overcurrent protection feature, but it's not enabled by default. To implement overcurrent protection, you need to set the OCP (OverCurrent Protection) pin high and configure the OCP threshold using the I2C interface. Refer to the datasheet and application notes for detailed instructions.
  • Although the datasheet specifies a maximum operating voltage of 5.5V, the VCC pin can tolerate up to 6.5V during power-up, but only for a short duration (typically <100ms). Exceeding this voltage or duration may damage the device.
  • To troubleshoot I2C communication issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Ensure that the I2C bus is properly terminated, and the slave address is correctly set. Use an oscilloscope or logic analyzer to monitor the I2C signals and identify any errors or bus contention.
  • The 7164L25TDB is rated for operation up to 125°C (TJ), but it's essential to consider the device's power dissipation, PCB thermal design, and surrounding environment when operating at high temperatures. Ensure that the device is properly heat-sinked, and the system is designed to handle the increased thermal stress.

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7164L25TDB Overview

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