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7164L45TDB - Renesas Electronics

Description: The 7164 5V CMOS SRAM is organized as 8K x 8. The 7164 offers a reduced power standby mode. The low-power (L) version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs of the IDT7164 are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation. Military grade product is available.

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7164L45TDB - Renesas Electronics - PCB symbol
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7164L45TDB - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - SD28
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7164L45TDB Details

  • Manufacturer Part Number:

    7164L45TDB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CDIP

  • Package Description:

    DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SD28

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    45 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-CDIP-T28

  • JESD-609 Code:

    e0

  • Memory Density:

    65536 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Standby Current-Max:

    0.0002 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.13 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

7164L45TDB Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-116) for thermal management. It suggests using a 4-layer PCB with a solid ground plane, placing thermal vias under the package, and using a thermal pad on the bottom of the package.
  • Renesas recommends following the thermal design guidelines, using a heat sink or thermal interface material, and ensuring good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms.
  • Renesas recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) for CIN, with a value between 4.7uF to 10uF. For COUT, use a low-ESR ceramic or electrolytic capacitor with a value between 10uF to 22uF. Ensure the capacitors meet the voltage and ripple current ratings specified in the datasheet.
  • Renesas provides a feedback network design guide in their application note (APL-AN-115). It suggests using a type-III compensation network, selecting the correct resistors and capacitors, and ensuring the feedback loop is properly compensated for stability and transient response.
  • Renesas recommends following good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding or filtering components. Additionally, consider using a common-mode choke or ferrite bead to reduce EMI emissions.

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7164L45TDB Overview

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