71T75602S166BGG - Renesas Electronics

71T75602S166BGG Details

• Manufacturer Part Number:

  71T75602S166BGG

• Brand Name:

  Renesas

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  PBGA

• Pin Count:

  119

• Manufacturer Package Code:

  BGG119

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Factory Lead Time:

  4 Weeks

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  3.5 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  166 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B119

• JESD-609 Code:

  e1

• Length:

  22 mm

• Memory Density:

  18874368 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  119

• Number of Words:

  524288 words

• Number of Words Code:

  512000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  512KX36

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA119,7X17,50

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.36 mm

• Standby Current-Max:

  0.04 A

• Standby Voltage-Min:

  2.38 V

• Supply Current-Max:

  0.245 mA

• Supply Voltage-Max (Vsup):

  2.625 V

• Supply Voltage-Min (Vsup):

  2.375 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  14 mm