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71T75602S166BGGI - Renesas Electronics

Description: The 71T75602 2.5V CMOS Synchronous SRAM organized as 512K x 36 (18 Megabit). It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71T75602 contains data I/O, address and control signal registers.

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71T75602S166BGGI - Renesas Electronics - PCB symbol
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71T75602S166BGGI - Renesas Electronics PCB footprint - BGA - BGA - BGG119 (PBGA 119)
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71T75602S166BGGI - Renesas Electronics - 3D model - BGA - BGG119 (PBGA 119)
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71T75602S166BGGI Details

  • Manufacturer Part Number:

    71T75602S166BGGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Pin Count:

    119

  • Manufacturer Package Code:

    BGG119

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.5 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B119

  • JESD-609 Code:

    e1

  • Length:

    22 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    119

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA119,7X17,50

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.36 mm

  • Standby Current-Max:

    0.06 A

  • Standby Voltage-Min:

    2.38 V

  • Supply Current-Max:

    0.265 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71T75602S166BGGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the 71T75602S166BGGI, which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance. It's essential to follow this guide to prevent overheating and ensure reliable operation.
  • Renesas recommends a specific power sequencing scheme for the 71T75602S166BGGI to prevent damage and ensure proper operation. This typically involves powering up the voltage regulators in a specific order, and Renesas provides guidelines for this in their application notes.
  • While the datasheet provides some information on output current and voltage, there may be additional limitations and considerations that are not immediately apparent. For example, the device may have current limiting or foldback protection, and Renesas may provide additional guidance on these limitations in their application notes or technical support resources.
  • Renesas provides troubleshooting guides and application notes that can help engineers identify and resolve common issues with the 71T75602S166BGGI. These resources may include debugging techniques, error code explanations, and fault diagnosis procedures.
  • Yes, the 71T75602S166BGGI has specific EMI/EMC requirements and considerations that must be taken into account during design and implementation. Renesas provides guidance on EMI/EMC compliance, including layout recommendations, filtering, and shielding requirements.

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71T75602S166BGGI Alternates

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Part Image 71T75602S166BGG Integrated Device Technology Inc

ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119
Part Image 71T75602S166BG Integrated Device Technology Inc

ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119
Part Image CY7C1370CV25-200BGI Cypress Semiconductor

ZBT SRAM, 512KX36, 3ns, CMOS, PBGA119
Part Image IDT71T75602S166B Renesas Electronics Corporation

ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119
Part Image IDT71T75602S166BGI8 Renesas Electronics Corporation

ZBT SRAM, 512KX36, 3.5ns, CMOS, PBGA119
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