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71V016SA12YG8 - Renesas Electronics

Description: The 71V016 3.3V CMOS SRAM is organized as 64K x 16. All bidirectional inputs and outputs of the 71V016 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used, requiring no clocks or refresh for operation.

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71V016SA12YG8 - Renesas Electronics PCB footprint - Other - Other - PBG44
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71V016SA12YG8 - Renesas Electronics  - 3D model - Other - PBG44
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71V016SA12YG8 Details

  • Manufacturer Part Number:

    71V016SA12YG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOJ

  • Pin Count:

    44

  • Manufacturer Package Code:

    PBG44

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Date Of Intro:

    2020-06-25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Memory IC Type:

    STANDARD SRAM

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    MATTE TIN

  • Time@Peak Reflow Temperature-Max (s):

    40

71V016SA12YG8 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 71V016SA12YG8 is -40°C to +85°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, typically -55°C to +125°C.
  • It's crucial to follow a controlled power-up and power-down sequence to prevent damage to the device. The recommended sequence is to power up VCC before VPP, and power down VPP before VCC. Additionally, ensure that the input signals are stable and within the recommended voltage range during power-up and power-down.
  • The maximum allowed voltage on the input pins of the 71V016SA12YG8 is VCC + 0.5V, but not to exceed 5.5V. Exceeding this voltage can cause damage to the device or affect its reliability.
  • To ensure data retention in the 71V016SA12YG8 during power-down, it's essential to follow the recommended power-down sequence and ensure that the VCC voltage is reduced to 0V before the VPP voltage. Additionally, the device should be in a standby mode (CE = HIGH) before power-down.
  • For optimal performance and reliability, it's recommended to follow a good PCB layout and design practice. This includes using a solid ground plane, minimizing signal trace lengths, and avoiding signal traces near the device's power pins. Additionally, ensure that the decoupling capacitors are placed close to the device's power pins.

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