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71V016SA20PHGI - Renesas Electronics

Description: The 71V016 3.3V CMOS SRAM is organized as 64K x 16. All bidirectional inputs and outputs of the 71V016 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used, requiring no clocks or refresh for operation.

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71V016SA20PHGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PHG44
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71V016SA20PHGI - Renesas Electronics  - 3D model - Small Outline Packages - PHG44
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71V016SA20PHGI Details

  • Manufacturer Part Number:

    71V016SA20PHGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP

  • Package Description:

    TSOP2-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PHG44

  • ECCN Code:

    3A991.b.2.b

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    111 Weeks

  • Date Of Intro:

    2020-06-25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    20 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e3

  • Length:

    18.41 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    44

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64KX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.01 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10.16 mm

71V016SA20PHGI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 71V016SA20PHGI is -40°C to +85°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • It's crucial to follow a controlled power-up and power-down sequence to prevent damage to the device. The recommended sequence is to power up VCC first, followed by VPP, and then the clock signal. During power-down, the sequence should be reversed. Additionally, ensure that the input signals are stable and within the recommended voltage range during power-up and power-down.
  • The maximum clock frequency supported by the 71V016SA20PHGI is 20 MHz, as specified in the datasheet. However, it's essential to consider the system's noise margin, signal integrity, and power consumption when operating at higher frequencies.
  • To ensure data retention in the 71V016SA20PHGI during power-down, it's essential to follow the recommended power-down sequence and ensure that the VCC and VPP voltages are below 0.5V. Additionally, the device should be in a standby mode (CE = HIGH) before power-down to minimize power consumption and prevent data loss.
  • A good layout and routing strategy for the 71V016SA20PHGI involves minimizing signal trace lengths, using controlled impedance traces, and avoiding signal crosstalk. It's also essential to place decoupling capacitors close to the device's power pins and ensure that the power and ground planes are well-connected.

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