Part Image

71V124SA15TYGI - Renesas Electronics

Description: The 71V124 3.3V CMOS SRAM is organized as 128K x 8. The JEDEC center power/GND pinout reduces noise generation and improves system performance. All bidirectional inputs and outputs of the 71V124 are LVTTL-compatible and operation is from a single 3.3V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation.

Download 71V124SA15TYGI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
71V124SA15TYGI - Renesas Electronics PCB footprint - Other - Other - PJG32
click to zoom
3D Models
71V124SA15TYGI - Renesas Electronics  - 3D model - Other - PJG32
click to zoom

71V124SA15TYGI Details

  • Manufacturer Part Number:

    71V124SA15TYGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOJ

  • Pin Count:

    32

  • Manufacturer Package Code:

    PJG32

  • ECCN Code:

    3A991.b.2.b

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-J32

  • JESD-609 Code:

    e3

  • Length:

    20.955 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOJ

  • Package Equivalence Code:

    SOJ32,.34

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.7592 mm

  • Standby Current-Max:

    0.01 A

  • Standby Voltage-Min:

    3 V

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.62 mm

71V124SA15TYGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5053) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 71V124SA15TYGI has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow and avoid blocking the airflow around the device.
  • Renesas recommends a power-up sequence of VCC followed by VDDQ, with a delay of at least 100 ns between the two power rails. This ensures proper initialization and prevents latch-up or other issues.
  • A reliable reset circuit can be implemented using an external reset IC or a discrete component circuit. The reset signal should be asserted for at least 10 ns and should be synchronized with the clock signal to ensure proper reset operation.
  • Signal integrity and termination are critical for high-speed signals. Renesas recommends using a 50-ohm transmission line impedance, and terminating signals with a 50-ohm resistor to ground. Additionally, use a signal integrity analysis tool to optimize signal routing and minimize reflections.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

71V124SA15TYGI Overview

Use the download button to access the 71V124SA15TYGI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 71V12, or try a keyword search, such as SRAMs

Parts related to 71V124SA15TYGI

Showing 0 results

71V124SA15TYGI Alternates

Showing results

Image Part Number Model
Part Image IDT71V124SA15TYGI8 Integrated Device Technology Inc

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32

Part Image IDT71V124SA15TYI Integrated Device Technology Inc

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32

Part Image IDT71V124SA15TYGI8 Renesas Electronics Corporation

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32

Part Image IDT71V124SA15TYI8 Integrated Device Technology Inc

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32

Part Image 71V124HSA15TYGI Integrated Device Technology Inc

Standard SRAM, 128KX8, 15ns, CMOS, PDSO32

For a full list of alternate parts for 71V124SA15TYGI, check out Findchips.com