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71V25761S166PFGI8 - Renesas Electronics

Description: SRAM 4Mb PBSRAM 128K x 36 w/2.5V I/O Pipeline

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PCB Footprints
71V25761S166PFGI8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG-100
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3D Models
71V25761S166PFGI8 - Renesas Electronics  - 3D model - Quad Flat Packages - PKG-100
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71V25761S166PFGI8 Details

  • Manufacturer Part Number:

    71V25761S166PFGI8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.5 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • JESD-30 Code:

    R-PQFP-G100

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

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