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71V30L35TFGI8 - Renesas Electronics

Description: The 71V30 high-speed 1K x 8 Dual-Port Static RAM is designed to be used as a stand-alone 8-bit Dual-Port SRAM. It has two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature, controlled by CE, permits the on chip circuitry of each port to enter a very low standby power mode.

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PCB Footprints
71V30L35TFGI8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PPG64 PIN
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71V30L35TFGI8 - Renesas Electronics  - 3D model - Quad Flat Packages - PPG64 PIN
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71V30L35TFGI8 Details

  • Manufacturer Part Number:

    71V30L35TFGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    64

  • Manufacturer Package Code:

    PPG64

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    35 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQFP-F64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Memory Density:

    8192 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    64

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFF

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Voltage-Min:

    3 V

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

71V30L35TFGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3804EU0100) which includes thermal design considerations, such as placing thermal vias under the package and using a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' recommended operating conditions, including derating the device's power consumption and using a heat sink or thermal management system to keep the junction temperature below 150°C.
  • Renesas recommends a power sequencing scheme where the core voltage (VCC) is powered up before the input/output voltage (VDDQ). The supply voltage ramp-up should be controlled to avoid voltage overshoots and ensure a smooth transition to the operating voltage.
  • To prevent latch-up conditions, it's essential to follow Renesas' guidelines for input/output voltage and current limits, as well as ensuring that the device is operated within the recommended operating conditions. In case of a latch-up event, power cycling the device can help recover from the condition.
  • Renesas recommends following standard ESD protection and handling procedures, such as using an ESD wrist strap or mat, storing the devices in anti-static packaging, and avoiding direct contact with the device pins.

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