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71V3556SA166BQGI - Renesas Electronics

Description: The 71V3556 3.3V CMOS Synchronous SRAM is organized as 128K x 36. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V3556 contains data I/O, address and control signal registers.

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71V3556SA166BQGI - Renesas Electronics PCB footprint - BGA - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V3556SA166BQGI - Renesas Electronics  - 3D model - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
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71V3556SA166BQGI Details

  • Manufacturer Part Number:

    71V3556SA166BQGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    165

  • Manufacturer Package Code:

    BQG165

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    3.5 ns

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.045 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

71V3556SA166BQGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for the 71V3556SA166BQGI, which includes recommendations for PCB layout, thermal management, and decoupling. It's essential to follow these guidelines to ensure optimal performance, low noise, and thermal stability.
  • The 71V3556SA166BQGI has an internal POR and BOD circuitry. To implement POR, connect the VCC pin to a power supply with a suitable voltage regulator. For BOD, connect the VCC pin to a voltage regulator with a brown-out detection feature. You can also use external POR and BOD circuits if required.
  • The maximum clock frequency for the 71V3556SA166BQGI is 166 MHz. To configure the clock settings, use the Clock Control Register (CCR) to select the clock source, divider, and multiplier. Refer to the datasheet and user manual for detailed information on clock configuration and timing diagrams.
  • The 71V3556SA166BQGI supports JTAG boundary scan and debugging. Connect the JTAG pins (TCK, TMS, TDI, TDO, and TRST) to a JTAG interface or a debug adapter. Use a JTAG software tool, such as Renesas' E1 emulator or a third-party tool, to perform boundary scan and debugging.
  • To ensure EMC and minimize EMI, follow Renesas' guidelines for PCB layout, component selection, and shielding. Use a multi-layer PCB with a solid ground plane, and consider using EMI filters or ferrite beads on the power and signal lines. Additionally, ensure that the device is properly decoupled and bypassed.

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71V3556SA166BQGI Overview

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Part Image IDT71V3556SA166BQGI8 Integrated Device Technology Inc

ZBT SRAM, 128KX36, 3.5ns, CMOS, PBGA165

Part Image 71V3556SA166BQI8 Integrated Device Technology Inc

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Part Image 71V3556XSA166BQGI Renesas Electronics Corporation

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Part Image IDT71V3556SA166BQGI Renesas Electronics Corporation

ZBT SRAM, 128KX36, 3.5ns, CMOS, PBGA165

Part Image IDT71V3556XSA166BQI8 Renesas Electronics Corporation

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