Please enter a minimum 3 letters or numbers
Technical Content
Part Image

71V3556SA166BQGI8 - Renesas Electronics

Description: The 71V3556 3.3V CMOS Synchronous SRAM is organized as 128K x 36. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V3556 contains data I/O, address and control signal registers.

Download 71V3556SA166BQGI8 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
71V3556SA166BQGI8 - Renesas Electronics - PCB symbol
click to zoom
PCB Footprints
71V3556SA166BQGI8 - Renesas Electronics PCB footprint - BGA - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
click to zoom
3D Models
71V3556SA166BQGI8 - Renesas Electronics - 3D model - BGA - 165 Fine Pitch Ball Grid Array (fBGA) Package Diagram Outline
click to zoom

71V3556SA166BQGI8 Details

  • Manufacturer Part Number:

    71V3556SA166BQGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    165

  • Manufacturer Package Code:

    BQG165

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    3.5 ns

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    13 mm

71V3556SA166BQGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN0265EJ0100) which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize noise.
  • Renesas recommends using an external POR circuit with a voltage supervisor IC (such as the RP108 series) to ensure a reliable power-on reset. The POR circuit should be designed to detect the power supply voltage and generate a reset signal to the 71V3556SA166BQGI8 when the voltage is below the minimum operating voltage.
  • The 71V3556SA166BQGI8 has an operating temperature range of -40°C to +85°C, but it's recommended to operate within the industrial temperature range of -40°C to +70°C for optimal performance and reliability.
  • Renesas provides a JTAG interface for debugging and programming the 71V3556SA166BQGI8. Engineers can use a JTAG adapter and a software development tool such as the Renesas Flash Development Toolkit (FDT) to access the JTAG interface and perform debugging and programming tasks.
  • Renesas recommends implementing electrostatic discharge (ESD) protection measures such as using ESD-sensitive handling procedures, ESD-protected workbenches, and ESD-protected packaging to prevent damage to the 71V3556SA166BQGI8 during handling and assembly.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

71V3556SA166BQGI8 Overview

Use the download button to access the 71V3556SA166BQGI8 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 71V35, or try a keyword search, such as SRAMs

Parts related to 71V3556SA166BQGI8

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑