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71V3558SA100BQGI8 - Renesas Electronics

Description: SRAM SRAM Memory

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71V3558SA100BQGI8 - Renesas Electronics PCB footprint - BGA - BGA - BQG165
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71V3558SA100BQGI8 - Renesas Electronics  - 3D model - BGA - BQG165
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71V3558SA100BQGI8 Details

  • Manufacturer Part Number:

    71V3558SA100BQGI8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    5 ns

  • Clock Frequency-Max (fCLK):

    100 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA165,11X15,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.045 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.255 mA

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

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