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71V3576S133PFGI - Renesas Electronics

Description: The 71V3576 3.3V CMOS SRAM is organized as 128K x 36. The 71V3576 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

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71V3576S133PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG-100
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71V3576S133PFGI Details

  • Manufacturer Part Number:

    71V3576S133PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Package Description:

    20 X 14 MM, ROHS COMPLIANT, PLASTIC, TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-F100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFF

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.035 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.26 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V3576S133PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5153) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 71V3576S133PFGI has a thermal pad on the bottom of the package. Renesas recommends using a thermal interface material (TIM) and a heat sink to dissipate heat. A thermal design guide is available in the datasheet and application notes.
  • The input clock signal should be a differential signal with a frequency range of 10 MHz to 133 MHz, and an amplitude of 1.8 V to 3.3 V. The clock signal should also meet the specified jitter and skew requirements outlined in the datasheet.
  • The 71V3576S133PFGI has several operating modes, including PLL bypass, clock divider, and power-down modes. These modes can be configured using the device's control pins and registers. Refer to the datasheet and application notes for specific configuration details.
  • Renesas recommends following proper PCB design and layout practices to minimize EMI and RFI. This includes using ground planes, shielding, and filtering to reduce noise and radiation. Additionally, the device's output drivers can be configured to reduce EMI and RFI.

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71V3576S133PFGI Alternates

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Part Image 71V3576S133PFGI Integrated Device Technology Inc

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