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71V546S133PFGI - Renesas Electronics

Description: The 71V546 3.3V CMOS SRAM is organized as 128K x 36 bits. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus it has been given the name ZBTTM, or Zero Bus Turn-around. The 71V546 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.

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71V546S133PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin Plastic Thin Quad Flatpack (PKG100)
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71V546S133PFGI Details

  • Manufacturer Part Number:

    71V546S133PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.045 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.31 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V546S133PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5053) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • The 71V546S133PFGI has a specific power-up sequence requirement. Renesas recommends using an external power sequencer or a dedicated power management IC to ensure proper power-up and power-down sequencing.
  • The internal oscillator has a limited frequency range and accuracy. For applications requiring high-frequency accuracy or synchronization with an external clock, it's recommended to use an external clock source, such as a crystal oscillator or a clock generator.
  • The 71V546S133PFGI has multiple power-saving modes, including sleep, standby, and shutdown. Each mode has different power consumption and wake-up time trade-offs. Renesas provides guidelines for selecting the appropriate power-saving mode based on the application's requirements.
  • Renesas recommends following proper PCB design and layout practices, such as using ground planes, shielding, and decoupling capacitors, to minimize EMI and RFI. Additionally, using EMI filters and common-mode chokes can help reduce emissions.

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71V546S133PFGI Overview

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