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71V632S7PFG - Renesas Electronics

Description: The 71V632 3.3V CMOS SRAM is organized as 64K x 32. The pipelined burst architecture provides cost-effective 3-1-1-1 secondary cache performance for processors up to 117MHz. The 71V632 SRAM contains write, data, address, and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

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71V632S7PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100--
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71V632S7PFG - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100--
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71V632S7PFG Details

  • Manufacturer Part Number:

    71V632S7PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    7 ns

  • Additional Feature:

    ALSO REQUIRES 3.3V I/O SUPPLY

  • Clock Frequency-Max (fCLK):

    66 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    65536 words

  • Number of Words Code:

    64000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    64KX32

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.16 mA

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

Trust Checks

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71V632S7PFG Overview

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Part Image 71V632S7PFG Integrated Device Technology Inc

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Part Image IDT71V632S7PFGI8 Renesas Electronics Corporation

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Part Image IDT71V632S7PF9 Integrated Device Technology Inc

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Part Image IDT71V632S7PFI Integrated Device Technology Inc

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