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71V67603S166PFG - Renesas Electronics

Description: The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.The order of these three addresses are defined by the internal burst counter and the LBO input pin.

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71V67603S166PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
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71V67603S166PFG - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
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71V67603S166PFG Details

  • Manufacturer Part Number:

    71V67603S166PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.5 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.05 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.34 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V67603S166PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN983A) and evaluation board documentation. It's essential to follow these guidelines to ensure proper signal integrity, power supply decoupling, and thermal management.
  • Renesas recommends using an external POR circuit with a voltage supervisor IC (e.g., Renesas' ISL88003) to ensure a reliable reset signal. The datasheet provides guidelines for POR timing and voltage thresholds.
  • The 71V67603S166PFG has a thermal junction-to-case rating of 30°C/W. Ensure proper heat sinking, use thermal vias, and follow Renesas' thermal management guidelines to prevent overheating and ensure reliable operation.
  • The 71V67603S166PFG is not specifically designed for radiation-hardened or high-reliability applications. For such applications, consider Renesas' radiation-hardened or high-reliability product lines, such as the RH850 or RL78 families.
  • Use an oscilloscope to verify the oscillator output frequency and amplitude. Check the device's clock configuration, crystal oscillator circuit, and PCB layout for any issues. Consult Renesas' application notes and technical support resources for further guidance.

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71V67603S166PFG Overview

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Part Image 71V67603ZS166PFG Renesas Electronics Corporation

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