Part Image

71V67803S133PFGI - Renesas Electronics

Description: The 71V67803 3.3V CMOS SRAM is organized as 512K x 18. The 71V67803 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

Download 71V67803S133PFGI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
71V67803S133PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
click to zoom
3D Models
71V67803S133PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
click to zoom

71V67803S133PFGI Details

  • Manufacturer Part Number:

    71V67803S133PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.07 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.28 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V67803S133PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN983) and design guides (e.g., DG200001). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 71V67803S133PFGI has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink or thermal vias on the PCB. Follow Renesas' thermal management guidelines (e.g., AN984) and consider using a thermal simulation tool to optimize your design.
  • Renesas recommends a specific power sequencing and supply voltage ramp-up procedure to ensure proper device operation and prevent latch-up. Refer to the datasheet and application notes (e.g., AN982) for detailed guidelines on power-up and power-down sequences.
  • The 71V67803S133PFGI has a JTAG interface for debugging and testing. Renesas provides guidelines on implementing and testing the JTAG interface in their application notes (e.g., AN981) and user manuals. Ensure proper signal termination, voltage levels, and clock frequency to ensure reliable JTAG operation.
  • To ensure EMC and minimize EMI, follow Renesas' guidelines on PCB layout, component selection, and shielding. Use a shielded enclosure, and consider using EMI filters or common-mode chokes on the power supply lines. Additionally, ensure that your design meets the relevant EMC standards and regulations.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

71V67803S133PFGI Overview

Use the download button to access the 71V67803S133PFGI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 71V67, or try a keyword search, such as SRAMs

Parts related to 71V67803S133PFGI

Showing 0 results

71V67803S133PFGI Alternates

Showing results

Image Part Number Model
Part Image IDT71V67803S133PFGI8 Integrated Device Technology Inc

Cache SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

Part Image 71V67803ZS133PFI Integrated Device Technology Inc

Standard SRAM, 512KX18, 4.2ns, CMOS, PQFP100

Part Image 71V67803S133PFI8 Integrated Device Technology Inc

Standard SRAM, 512KX18, 4.2ns, CMOS, PQFP100

Part Image 71V67803ZS133PFGI Renesas Electronics Corporation

Standard SRAM, 512KX18, 4.2ns, CMOS, PQFP100

Part Image IDT71V67803S133PFI Integrated Device Technology Inc

Cache SRAM, 512KX18, 4.2ns, CMOS, PQFP100

For a full list of alternate parts for 71V67803S133PFGI, check out Findchips.com