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7284L15PAGI - Renesas Electronics

Description: The 7284 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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7284L15PAGI - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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7284L15PAGI - Renesas Electronics  - 3D model - Small Outline Packages - PAG56-ren1
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7284L15PAGI Details

  • Manufacturer Part Number:

    7284L15PAGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    36864 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

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7284L15PAGI Overview

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7284L15PAGI Alternates

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Part Image IDT7284L15PAG Integrated Device Technology Inc

FIFO, 4KX9, 15ns, Asynchronous, CMOS, PDSO56

Part Image 72V84L15PAG Integrated Device Technology Inc

FIFO, 4KX9, 15ns, Asynchronous, CMOS, PDSO56

Part Image IDT72V84L15PA8 Integrated Device Technology Inc

FIFO, 4KX9, 15ns, Asynchronous, CMOS, PDSO56

Part Image IDT7284L15PAG8 Renesas Electronics Corporation

FIFO, 4KX9, 15ns, Asynchronous, CMOS, PDSO56

Part Image 72V84L15PAGI Integrated Device Technology Inc

FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56

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