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72T18105L5BB - Renesas Electronics

Description: The 72T18105 is a 128K x 18 / 256K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

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PCB Footprints
72T18105L5BB - Renesas Electronics PCB footprint - BGA - BGA - BB240
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72T18105L5BB - Renesas Electronics  - 3D model - BGA - BB240
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72T18105L5BB Details

  • Manufacturer Part Number:

    72T18105L5BB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Pin Count:

    240

  • Manufacturer Package Code:

    BB240

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.6 ns

  • Additional Feature:

    ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE

  • Alternate Memory Width:

    9

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Cycle Time:

    5 ns

  • JESD-30 Code:

    S-PBGA-B240

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Memory Density:

    2359296 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    240

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA240,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.06 A

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

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72T18105L5BB Overview

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72T18105L5BB Alternates

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Image Part Number Model
Part Image IDT72T18105L5BBI Integrated Device Technology Inc

FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T18105L5BBG Renesas Electronics Corporation

FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T18105L5BB Renesas Electronics Corporation

FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T18105L5BBI Renesas Electronics Corporation

FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T18105L5BBGI Renesas Electronics Corporation

FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240

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