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72V05L25JGI8 - Renesas Electronics

Description: The 72V05 is a 8K x 9 dual-port FIFO that operates at Vcc between 3.0V and 3.6V. The device will load and empty data on a first-in/first-out basis. It uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V05L25JGI8 - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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72V05L25JGI8 - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - plg32
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72V05L25JGI8 Details

  • Manufacturer Part Number:

    72V05L25JGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • Cycle Time:

    35 ns

  • JESD-30 Code:

    R-PQCC-J32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    73728 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.55 mm

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V05L25JGI8 Frequently Asked Questions (FAQs)

  • Renesas recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • Renesas recommends following the recommended operating conditions, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermal monitoring IC to monitor the device temperature and take corrective action if it exceeds the recommended maximum junction temperature.
  • Renesas recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range. X5R or X7R dielectric types are suitable for this application.
  • While the 72V05L25JGI8 is capable of delivering up to 5A, it's essential to consider the thermal limitations and ensure the device is properly heat-sinked. Renesas recommends derating the output current based on the ambient temperature and PCB layout to prevent overheating.
  • Renesas recommends using a TVS (Transient Voltage Suppressor) diode or a voltage clamp circuit to protect the regulator from input voltage transients and surges. Additionally, consider using a fuse or a current limiter to prevent overcurrent conditions.

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