72V263L6BC - Renesas Electronics

72V263L6BC Details

• Manufacturer Part Number:

  72V263L6BC

• Brand Name:

  Renesas

• Pbfree Code:

  No

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  CABGA

• Package Description:

  11 X 11 MM, 1 MM PITCH, BGA-100

• Pin Count:

  100

• Manufacturer Package Code:

  BC100

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.71

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  4 ns

• Additional Feature:

  IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE

• Alternate Memory Width:

  9

• Clock Frequency-Max (fCLK):

  166 MHz

• Cycle Time:

  6 ns

• JESD-30 Code:

  S-PBGA-B100

• JESD-609 Code:

  e0

• Length:

  11 mm

• Memory Density:

  147456 bit

• Memory IC Type:

  OTHER FIFO

• Memory Width:

  18

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  100

• Number of Words:

  8192 words

• Number of Words Code:

  8000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  70 °C

• Organization:

  8KX18

• Output Enable:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA100,10X10,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  225

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.5 mm

• Standby Current-Max:

  0.015 A

• Supply Current-Max:

  0.035 mA

• Supply Voltage-Max (Vsup):

  3.45 V

• Supply Voltage-Min (Vsup):

  3.15 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  11 mm