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73M2901CE-IGV/F - Analog Devices

Description: V.22bis Single Chip Modem

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73M2901CE-IGV/F - Analog Devices - PCB symbol
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73M2901CE-IGV/F - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 32-Pin TQFP-+-+
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73M2901CE-IGV/F - Analog Devices - 3D model - Quad Flat Packages - 32-Pin TQFP-+-+
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73M2901CE-IGV/F Details

  • Manufacturer Part Number:

    73M2901CE-IGV/F

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    32-TQFP-7X7X1.0

  • Pin Count:

    32

  • Manufacturer Package Code:

    32-TQFP-7X7X1.0

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2010-07-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQFP-G32

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    TQFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    15.5 mA

  • Surface Mount:

    YES

  • Telecom IC Type:

    MODEM

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

73M2901CE-IGV/F Frequently Asked Questions (FAQs)

  • A good PCB layout for the 73M2901CE-IGV/F involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the 73M2901CE-IGV/F, use a high-quality power supply with low noise and ripple, and decouple the device with a 10uF capacitor between the VCC and GND pins. Additionally, use a 0.1uF capacitor between the VCC and AVCC pins to decouple the analog power supply.
  • The 73M2901CE-IGV/F has an operating temperature range of -40°C to +85°C, but it's recommended to operate the device within a temperature range of 0°C to +70°C for optimal performance and reliability.
  • To troubleshoot issues with the 73M2901CE-IGV/F, start by checking the power supply and decoupling, then verify the clock signal and reset pin functionality. Use an oscilloscope to check the signal integrity and noise levels on the device's pins. If the issue persists, consult the datasheet and application notes for guidance or contact Analog Devices Inc support.
  • The 73M2901CE-IGV/F is not specifically designed or qualified for radiation-hardened or high-reliability applications. If you need a device for such an application, you should consider using a device that is specifically designed and qualified for those requirements, such as a device with a QML or QPL certification.

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73M2901CE-IGV/F Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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