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742X083102JP - CTS

Description: Resistor Networks & Arrays 1K Ohms 5%

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PCB Footprints
742X083102JP - CTS PCB footprint - Other - Other - 1206 (3216 Metric)
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3D Models
742X083102JP - CTS  - 3D model - Other - 1206 (3216 Metric)
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742X083102JP Details

  • Manufacturer Part Number:

    742X083102JP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    CTS Corporation

  • YTEOL:

    8

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.063 W

  • First Element Resistance:

    1000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.252 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    1000 Ω

  • Size Code:

    0612

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    50 V

742X083102JP Frequently Asked Questions (FAQs)

  • Store the component in a dry, cool place, away from direct sunlight, and avoid exposing it to extreme temperatures (above 40°C or below -20°C) or humidity above 80%.
  • Use an ESD wrist strap or mat, and handle the component by the body or pins, avoiding direct contact with the leads or internal components.
  • Use a soldering temperature between 230°C to 250°C, and limit the soldering time to 3-5 seconds to prevent thermal damage.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and vibration-induced failure.
  • Use a soft-bristled brush and a mild solvent (e.g., isopropyl alcohol) to remove flux residue, avoiding harsh chemicals or abrasive materials that may damage the component.

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742X083102JP Overview

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