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744071101 - Würth Elektronik

Description: WE-TPC SMT Shielded Tiny Power Inductor Size 8043; L = 100 µH ; IR = 1 A; Isat = 0.9 A; RDC = 320 mΩ

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PCB Footprints
744071101 - Würth Elektronik PCB footprint - Other - Other - WE-TPC_8020/804392
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3D Models
744071101 - Würth Elektronik  - 3D model - Other - WE-TPC_8020/804392
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744071101 Details

  • Manufacturer Part Number:

    744071101

  • Brand Name:

    Wurth Electronik

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Wurth Elektronik

  • YTEOL:

    15

  • Case/Size Code:

    3131

  • Construction:

    Rectangular

  • Core Material:

    MANGANESE-ZINC

  • DC Resistance:

    0.32 Ω

  • Inductance-Nom (L):

    100 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.3 mm

  • Package Length:

    8 mm

  • Package Style:

    SMT

  • Package Width:

    8 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    1 A

  • Self Resonance Frequency:

    6 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    QUAD

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    30%

744071101 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the 744071101 can be found in the Wurth Elektronik's PCB Library or in the component's datasheet under the 'Packaging' or 'Layout' section. It's essential to follow the recommended footprint to ensure proper assembly and thermal performance.
  • The 744071101's thermal management is critical for its performance and lifespan. Ensure proper heat dissipation by providing a sufficient copper area on the PCB, using thermal vias, and applying a thermal interface material (TIM) between the component and the heat sink (if used). Refer to the datasheet for thermal resistance and junction temperature specifications.
  • The recommended soldering conditions for the 744071101 can be found in the datasheet or in Wurth Elektronik's soldering guide. Typically, a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. Ensure that your soldering process meets these conditions to prevent damage to the component.
  • The 744071101 is designed to withstand certain levels of vibration, but it's essential to consult the datasheet for specific vibration tolerance specifications. If your application exceeds these specifications, consider using additional mechanical support or vibration dampening measures to ensure the component's reliability.
  • To ensure the 744071101's EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding if necessary. Additionally, ensure that your system meets the relevant EMC standards and regulations for your application.

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744071101 Overview

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