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74479763210A - Würth Elektronik

Description: WE-PMI Power Multilayer Inductor Size 0603; L = 1.0 µH ; IR@40K = 900 mA; Isat = 650 mA; RDC = 200 mΩ

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74479763210A - Würth Elektronik PCB footprint - Inductors Chip - Inductors Chip - 74479763210A
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74479763210A - Würth Elektronik  - 3D model - Inductors Chip - 74479763210A
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74479763210A Details

  • Manufacturer Part Number:

    74479763210A

  • Brand Name:

    Wurth Electronik

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Wurth Elektronik

  • YTEOL:

    15

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Plastic, 7 Inch

  • Quality Factor-Min (at L-nom):

    12

  • Rated Current-Max:

    0.9 A

  • Self Resonance Frequency:

    120 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

74479763210A Frequently Asked Questions (FAQs)

  • The recommended land pattern for the 74479763210A can be found in the Wurth Elektronik's 'Layout Recommendations' document, which provides detailed information on pad layout, spacing, and geometry for optimal performance.
  • To ensure the 74479763210A operates within its specified temperature range, it's essential to provide adequate heat dissipation, avoid overheating, and maintain a stable ambient temperature. A thermal management strategy, such as using a heat sink or thermal interface material, can help achieve this.
  • To minimize EMI, it's recommended to use a shielded enclosure, keep the component away from high-frequency sources, and use proper grounding techniques. Additionally, consider using EMI-absorbing materials or shielding cans to reduce radiation and susceptibility.
  • While the 74479763210A is designed to be robust, it's essential to consider the vibration specifications and ensure the component is properly secured to the PCB using suitable mounting methods, such as screwing or adhesive bonding, to prevent mechanical stress and damage.
  • To ensure proper power sequencing, follow the recommended power-up and power-down sequences outlined in the datasheet. This typically involves powering up the component in a specific order, such as powering the analog supply before the digital supply, to prevent damage or malfunction.

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74479763210A Overview

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