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749199-1 - TE Connectivity

Description: Body Features: Primary Product Material Zinc | Cable Exit Angle 75° | Primary Product Plating Material Nickel over Copper | Configuration Features: Number of Positions 20 | Dimensions: Compatible Insulation Diameter Range .27 INCH | Compatible Insulation Diameter Range 6.86 MM | Housing Features: Compatible With Connector Shape D-Shaped | Body Orientation Straight | Mechanical Attachment: Thread Size 2-56 UNC | Packaging Features: Packaging Quantity 1 | Packaging Method Individual | Product Type Features:

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749199-1 - TE Connectivity  - 3D model
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749199-1 Details

  • Manufacturer Part Number:

    749199-1

  • Brand Name:

    AMP

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Factory Lead Time:

    12 Weeks, 6 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    0

  • Assembly Item Name:

    BACKSHELL

  • Cable Entry-Max:

    0.27 inch

  • Connector Support Type:

    CONNECTOR ACCESSORY

  • DIN Conformance:

    NO

  • IEC Conformance:

    NO

  • MIL Conformance:

    NO

  • Material:

    ZINC

  • Mounting Option 1:

    #2-56 UNC

  • Packing Method:

    BULK

  • Used With:

    D-SUB CONNECTOR

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749199-1 Overview

Use the download button to access the 749199-1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like 74919, or try a keyword search, such as Assembly Items

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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