74AUP1G08GM - NXP

74AUP1G08GM Details

• Manufacturer Part Number:

  74AUP1G08GM

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  SON

• Package Description:

  1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6

• Pin Count:

  6

• HTS Code:

  8542.39.00.60

• Manufacturer:

  NXP Semiconductors

• Family:

  AUP/ULP/V

• JESD-30 Code:

  R-PDSO-N6

• JESD-609 Code:

  e3

• Length:

  1.45 mm

• Logic IC Type:

  AND GATE

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  6

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VSON

• Package Equivalence Code:

  SOLCC6,.04,20

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, VERY THIN PROFILE

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  0.8 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1 mm