Part Image

74AUP2G57DPJ - Nexperia

Description: 74AUP2G57 - Low-power dual PCB configurable multiple function gate@en-us

Download 74AUP2G57DPJ Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
74AUP2G57DPJ - Nexperia PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
click to zoom
3D Models
74AUP2G57DPJ - Nexperia  - 3D model - Small Outline Packages - TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
click to zoom
  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for 74AUP2G57DPJ
  • Part Number 74AUP2G57DPJ
  • Manufacturer Nexperia
  • Pin Count 10
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
  • Released Date Nov 4, 2019
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

74AUP2G57DPJ Details

  • Manufacturer Part Number:

    74AUP2G57DPJ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    SOT552-1

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Family:

    AUP/ULP/V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Logic IC Type:

    MAJORITY LOGIC GATE

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

74AUP2G57DPJ Overview

Use the download button to access the 74AUP2G57DPJ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 74AUP, or try a keyword search, such as Gates

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

Parts related to 74AUP2G57DPJ

Showing 0 results