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74CB3T3245DGVRE4 - Texas Instruments

Description: Digital Bus Switch ICs 8B FET 2.5V/3.3V Lo-Vltg Bus Sw

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74CB3T3245DGVRE4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGV (R-PDSO-G20)
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74CB3T3245DGVRE4 - Texas Instruments  - 3D model - Small Outline Packages - DGV (R-PDSO-G20)
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74CB3T3245DGVRE4 Details

  • Manufacturer Part Number:

    74CB3T3245DGVRE4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    TVSOP-20

  • Pin Count:

    20

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3T/3VT

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.04 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

74CB3T3245DGVRE4 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the 74CB3T3245DGVRE4 is 250 MHz, but it can vary depending on the specific application and capacitive load.
  • To ensure signal integrity, use proper PCB layout techniques, such as minimizing trace length, using impedance-controlled traces, and adding termination resistors as needed. Additionally, consider using a signal integrity analysis tool to simulate and optimize your design.
  • The recommended power-up sequence is to apply VCC first, followed by VEE, and then the input signals. This helps prevent latch-up and ensures proper device operation.
  • Yes, the 74CB3T3245DGVRE4 is compatible with 3.3V systems, but ensure that the input signals do not exceed the maximum rating of 3.6V. Additionally, consider the output voltage levels and ensure they are compatible with the receiving device.
  • The 74CB3T3245DGVRE4 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap, mat, or workstation, and ensure that the device is properly grounded during handling.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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