Part Image

74FST3257MN2TWG - onsemi

Description: RON < 4 Ω Typical; Less Than 0.25 ns-Max Delay Through Switch; Nearly Zero Standby Current; No Circuit Bounce; Control Inputs are TTL/CMOS Compatible; Pin-For-Pin Compatible With QS3257, FST3257, CBT3257; All Popular Packages: QSOP-16, TSSOP-16, SOIC-16; Pb-Free Packages are Available

Download 74FST3257MN2TWG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
74FST3257MN2TWG - onsemi PCB footprint - Other - Other - QFN16, 2.5x3.5, 0.5P CASE 485AW−01 ISSUE O
click to zoom
3D Models
74FST3257MN2TWG - onsemi  - 3D model - Other - QFN16, 2.5x3.5, 0.5P CASE 485AW−01 ISSUE O
click to zoom

74FST3257MN2TWG Details

  • Manufacturer Part Number:

    74FST3257MN2TWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN-16

  • Manufacturer Package Code:

    485AW

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CBT/FST/QS/5C/B

  • JESD-30 Code:

    R-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    4

  • Number of Ports:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.1X.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

74FST3257MN2TWG Overview

Use the download button to access the 74FST3257MN2TWG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 74FST, or try a keyword search, such as Bus Driver/Transceivers

Parts related to 74FST3257MN2TWG

Showing 0 results