74HC2G17GV,125 - Nexperia

74HC2G17GV,125 Details

• Manufacturer Part Number:

  74HC2G17GV,125

• Brand Name:

  Nexperia

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  TSOP

• Package Description:

  TSOP-6

• Pin Count:

  6

• Manufacturer Package Code:

  SOT457

• Country Of Origin:

  Malaysia

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  8 Weeks

• Date Of Intro:

  2017-02-01

• Manufacturer:

  Nexperia

• YTEOL:

  5.35

• Family:

  HC/UH

• JESD-30 Code:

  R-PDSO-G6

• JESD-609 Code:

  e3

• Length:

  2.9 mm

• Logic IC Type:

  BUFFER

• Moisture Sensitivity Level:

  1

• Number of Functions:

  2

• Number of Inputs:

  1

• Number of Terminals:

  6

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSOP

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE

• Packing Method:

  TR, 7 INCH

• Peak Reflow Temperature (Cel):

  260

• Propagation Delay (tpd):

  175 ns

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max (Vsup):

  6 V

• Supply Voltage-Min (Vsup):

  2 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.95 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  1.5 mm