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74LCX16245MTD - onsemi

Description: 5V tolerant inputs and outputs; 4.5 ns tPD max (VCC = 3.3V), 20 µA ICC max; ESD performance: Human body model > 2000V Machine model > 200V; Uses patented noise/EMI reduction circuitry; ±24 mA output drive (VCC = 3.0V); 2.3V-3.6V VCC specifications provided; Supports live insertion/withdrawal (Note 1); Power down high impedance inputs and outputs; Latch-up performance exceeds 500 mA; Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA)

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74LCX16245MTD - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 48- lead shrink tssop
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74LCX16245MTD - onsemi  - 3D model - Small Outline Packages - 48- lead shrink tssop
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74LCX16245MTD Details

  • Manufacturer Part Number:

    74LCX16245MTD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-48

  • Package Description:

    TSSOP-48

  • Manufacturer Package Code:

    948BQ

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    5V TOLERANT INPUTS AND OUTPUTS

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    8

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    4.5 ns

  • Propagation Delay (tpd):

    5.4 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

74LCX16245MTD Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the 74LCX16245MTD is 250 MHz.
  • Yes, the 74LCX16245MTD is compatible with both 3.3V and 5V systems, making it a versatile component for various applications.
  • The propagation delay of the 74LCX16245MTD is typically around 2.5 ns, but this can vary depending on the operating conditions and load capacitance.
  • Yes, the 74LCX16245MTD is rated for operation up to 125°C, making it suitable for high-temperature applications.
  • Yes, the 74LCX16245MTD is a low-power device, with a typical quiescent current of around 10 μA, making it suitable for power-sensitive applications.

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