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74LVC16827APAG8 - Renesas Electronics

Description: The 74LVC16827A 20-bit buffer provides high-performance bus interface buffering for wide data/address paths or buses carrying parity and can operate as two 10-bit buffers or one 20-bit buffer. The 74LVC16827A buffer is ideally suited for driving high capacitance loads and low impedance backplanes. All pins can be driven from either 3.3V or 5V devices which allows the use of the device as a translator in a mixed 3.3V/5V supply system. The 74LVC16827A operates at -40C to +85C

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74LVC16827APAG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56_1
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74LVC16827APAG8 - Renesas Electronics  - 3D model - Small Outline Packages - PAG56_1
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74LVC16827APAG8 Details

  • Manufacturer Part Number:

    74LVC16827APAG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    4.1 ns

  • Propagation Delay (tpd):

    4.7 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    6.1 mm

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74LVC16827APAG8 Overview

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Part Image 74LVC16827APAG Integrated Device Technology Inc

Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56

Part Image 74LVC16827APAG8 Integrated Device Technology Inc

Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56

Part Image 74LVC16827APAG Renesas Electronics Corporation

Bus Driver, LVC/LCX/Z Series, 2-Func, 10-Bit, True Output, CMOS, PDSO56